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Thermoformed packaging with conductive and dissipative ESD properties that protect sensitive electronic components.
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Design of WIP and dunnage trays for organization, transport, and efficient assembly of parts.
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Protection against electrostatic discharge, vibration, and contamination during production and logistics processes.
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Customized solutions with precise dimensional control for electronic cards, semiconductors, and assemblies.
Conductive or dissipative properties that control the accumulation and discharge of static electricity, protecting sensitive components during handling, assembly, and transport.
High structural rigidity and mechanical resistance, providing dimensional support, impact protection, and stability during handling, stacking, and transport of electronic components.
We develop specialized thermoformed packaging for the electronics industry, designed to protect sensitive components against electrostatic discharge and mechanical damage. We manufacture trays, WIP trays, and dunnage with conductive or dissipative ESD materials that guarantee safety, order, and efficiency in manufacturing, assembly, and logistics processes for electronic products.
These thermoformed ESD trays are used for handling and protecting motherboards, assembled electronic cards (PCBAs), semiconductors, chips and integrated circuits, electronic modules and sensors, as well as connectors, SMT components, power supplies, hard drives, storage components, and electronic assemblies for industrial, automotive, and telecommunications applications.
PCBs require thermoformed trays with dimensional control and ESD properties that protect their tracks and components during manufacturing, assembly, and transport.
Semiconductors need ESD thermoformed packaging that dissipates electrostatic charges and prevents electrical and mechanical damage in critical processes.
Electronic sensors use thermoformed trays that ensure physical protection, dimensional stability, and ESD control to maintain their precision and operation.